Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74ALS229BDW
|
TI | 功能相似 | SOIC-20 |
16 】 5异步先入先出存储器 16 】 5 ASYNCHRONOUS FIRST-IN, FIRST-OUT MEMORY
|
||
SN74ALS233BDWR
|
TI | 功能相似 | SOIC |
16 x 5 asynchronous FIFO memory 20-SOIC 0 to 70
|
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