Technical parameters/resistance: 22.0 kΩ
Technical parameters/resistance deviation: ±2 %
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
4114R-1-223
|
Bourns J.W. Miller | 功能相似 | DIP-14 |
Res Thick Film NET 22KΩ 2% 2W ±100ppm/℃ ISOL Molded 14Pin DIP Pin Thru-Hole
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review