Technical parameters/product series: NRSN
Technical parameters/resistance: 330 KΩ
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: 0603
External dimensions/length: 3.2 mm
External dimensions/width: 1.6 mm
External dimensions/height: 0.55 mm
External dimensions/packaging: 0603
Physical parameters/temperature coefficient: ±200 ppm/℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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|
Bourns J.W. Miller | 功能相似 | 1206 |
Res Thick Film Array 330KΩ 5% 0.25W(1/4W) ±200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Concave SMD T/R
|
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EXBV8V334JV
|
Panasonic | 功能相似 | 1206 |
Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.063W(1/16W), 330000Ω, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0612, CHIP
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