Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HVQCCN
External dimensions/packaging: HVQCCN
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ICS8735AKI-01LF
|
Integrated Device Technology | 功能相似 | HVQCCN |
IC CLK GEN ZD LVPECL 32-VFQFPN
|
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