Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TIBPAL16L8-25CN
|
TI | 功能相似 | DIP-20 |
TEXAS INSTRUMENTS TIBPAL16L8-25CN 芯片, PAL器件, 3态, 25ns, 20DIP
|
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