Encapsulation parameters/installation method: PCB
Encapsulation parameters/Encapsulation: SO
External dimensions/packaging: SO
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TISP4400M3BJR
|
Bourns J.W. Miller | 功能相似 | DO-214AA-2 |
双向晶闸管过电压保护 BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
|
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