Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M74HC368B1R
|
ST Microelectronics | 功能相似 | DIP-16 |
STMICROELECTRONICS M74HC368B1R 芯片, 74HC CMOS逻辑器件
|
||
SN54HC368J
|
TI | 完全替代 | CDIP |
具有三态输出HEX公交车司机 HEX BUS DRIVERS WITH 3-STATE OUTPUTS
|
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