Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: CDIP
External dimensions/packaging: CDIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD4094BF3A
|
TI | 功能相似 | CDIP |
CMOS 8级移位和商店努斯注册 CMOS 8-Stage Shift-and-Store Nus Register
|
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