Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: PDIP
External dimensions/packaging: PDIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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ON Semiconductor | 功能相似 | DIP |
TEXAS INSTRUMENTS SN74LS373N 逻辑芯片, 透明D型锁存器, 8路, 3态, DIP-20
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SN74LS373N
|
Motorola | 功能相似 | DIP |
TEXAS INSTRUMENTS SN74LS373N 逻辑芯片, 透明D型锁存器, 8路, 3态, DIP-20
|
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