Technical parameters/number of contacts: 14
Technical parameters/Contact electroplating: Nickel, Gold
Technical parameters/rated current: 1.00 A
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 2.54 mm
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Beryllium Copper
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
110-43-314-41-001000
|
Mill-Max | 功能相似 | DIP |
MILL MAX 110-43-314-41-001000 芯片插座, DIP, 14脚
|
||
110-93-314-41-001000
|
Mill-Max | 功能相似 | DIP |
MILL MAX 110-93-314-41-001000 芯片插座, DIP, 14脚, 通孔安装
|
||
115-43-314-41-003000
|
Mill-Max | 功能相似 | DIP |
MILL MAX 115-43-314-41-003000 插座, DIP, 14路, 通孔
|
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