Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: Axial
External dimensions/packaging: Axial
Physical parameters/medium materials: Tantalum
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Vishay Semiconductor | 功能相似 | Through Hole |
15uF ±10% 50V Φ7.34mm 17.42mm
|
||
|
|
VISHAY | 功能相似 | Axial |
15uF ±10% 50V Φ7.34mm 17.42mm
|
||
|
|
KEMET Corporation | 功能相似 |
15uF ±10% 50V Φ7.34mm 17.42mm
|
|||
|
|
Vishay Semiconductor | 功能相似 | Through Hole |
15uF ±10% 50V Φ7.34mm 17.42mm
|
||
|
|
KEMET Corporation | 功能相似 |
15uF ±10% 50V Φ7.34mm 17.42mm
|
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