Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP
External dimensions/packaging: TSOP
Other/Product Lifecycle: End of Life
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MT46V256M4P-6T:A
|
Micron | 功能相似 | TSOP-66 |
DRAM Chip DDR SDRAM 1Gbit 256Mx4 2.5V 66Pin TSOP Tray
|
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