Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UCC5606DP
|
TI | 功能相似 | SOIC-16 |
SCSI 接口集成电路 9line 3-5V SCSI Mult
|
||
|
|
Unitrode | 功能相似 | SOIC-16 |
SCSI 接口集成电路 9line 3-5V SCSI Mult
|
||
|
|
Unitrode | 功能相似 | SOIC-16 |
Lowest Capacitance 9-Line 3-5V SE Terminator for SCSI Through Ultra SCSI with Reverse Disconnect 16-SOIC 0 to 70
|
||
UCC5606DPTR
|
TI | 功能相似 | SOIC-16 |
Lowest Capacitance 9-Line 3-5V SE Terminator for SCSI Through Ultra SCSI with Reverse Disconnect 16-SOIC 0 to 70
|
||
UCC5606DPTRG4
|
TI | 功能相似 | SOIC-16 |
SCSI Termination 3.3V/5V 110Ω 16Pin SOIC T/R
|
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