Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TSOP
External dimensions/packaging: TSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AM29F400BB-90ED
|
Spansion | 功能相似 | TSOP |
IC, FLASH, 4Mbit, 90NS, TSOP-48
|
||
AM29F400BB-90EF
|
Cypress Semiconductor | 功能相似 | TSOP-48 |
IC, FLASH, 4Mbit, 90NS, TSOP-48
|
||
AM29F400BB-90EF
|
Spansion | 功能相似 | TSOP-48 |
IC, FLASH, 4Mbit, 90NS, TSOP-48
|
||
AM29F400BB-90SC
|
Spansion | 类似代替 | SOP |
Flash Memory IC
|
||
AM29F400BB-90SC
|
AMD | 类似代替 | SOP |
Flash Memory IC
|
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