Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 | DIP |
低功耗CMOS运算放大器 Low Power CMOS Operational Amplifier
|
||
LPC661AIN
|
National Semiconductor | 功能相似 | DIP |
低功耗CMOS运算放大器 Low Power CMOS Operational Amplifier
|
||
LPC661AMN
|
National Semiconductor | 功能相似 | DIP |
低功耗CMOS运算放大器 Low Power CMOS Operational Amplifier
|
||
|
|
National Semiconductor | 功能相似 | MDIP |
运算放大器 LPC661IN MDIP-8
|
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