Technical parameters/operating temperature (Max): 200 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 25000 mW
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-66
External dimensions/packaging: TO-66
Physical parameters/materials: Silicon
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Motorola | 功能相似 | TO-66-2 |
Trans GP BJT NPN 80V 4A 3Pin(2+Tab) TO-66
|
||
|
|
ETC | 功能相似 |
Trans GP BJT NPN 80V 4A 3Pin(2+Tab) TO-66
|
|||
|
|
Semelab | 功能相似 | TO-66 |
Trans GP BJT NPN 80V 4A 3Pin(2+Tab) TO-66
|
||
2N3767
|
Central Semiconductor | 功能相似 | TO-66 |
Trans GP BJT NPN 80V 4A 3Pin(2+Tab) TO-66
|
||
2N3767LEADFREE
|
Central Semiconductor | 功能相似 | TO-66 |
TO-66 NPN 80V 4A
|
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