Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-14
External dimensions/packaging: TSSOP-14
Other/Product Lifecycle: Supply in progress
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPA6133A2
|
TI | 功能相似 |
具有 GPIO 控制的 138mW DirectPath 耳机放大器
|
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