Technical parameters/minimum current amplification factor (hFE): 40
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-18
External dimensions/packaging: TO-18
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Box
Compliant with standards/RoHS standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2N3964
|
Central Semiconductor | 功能相似 | TO-18 |
2N3964 系列 45 V 200 mA 360 mW 通孔 硅 PNP 晶体管 - TO-18
|
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