Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP
External dimensions/packaging: TSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX6339PUT+
|
Maxim Integrated | 功能相似 | SOT-23 |
Processor Supervisor 4.63V/3.08V/Adj/-4.63V -5V/1.8V/2.5V/3V/3.3V/5V 6Pin SOT-23
|
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