Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TSOP1
External dimensions/packaging: TSOP1
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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|
ST Microelectronics | 功能相似 | TSOP1 |
4千兆, 8千兆, 2112字节/ 1056字第3V , NAND闪存 4 Gbit, 8 Gbit, 2112 Byte/1056 Word Page 3V, NAND Flash Memories
|
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