Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: CDIP
External dimensions/height: 3.56 mm
External dimensions/packaging: CDIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TIBPAL16R8-15CN
|
TI | 功能相似 | DIP-20 |
高性能影响é PAL )电路 HIGH-PERFORMANCE IMPACT E PAL) CIRCUITS
|
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