Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: SSOP
External dimensions/length: 10.1 mm
External dimensions/width: 5.3 mm
External dimensions/packaging: SSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M81019FP
|
Mitsubishi | 功能相似 | SSOP |
High Voltage Half-Bridge Driver
|
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