Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/height: 1.5 mm
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Rail
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 完全替代 | DIP |
六反相缓冲器,具有3态输出 Hex Inverter Buffer with 3-STATE Outputs
|
||
74F366SC
|
Fairchild | 完全替代 | SOIC |
六反相缓冲器,具有3态输出 Hex Inverter Buffer with 3-STATE Outputs
|
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