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Model TIBPAL16R6-10MJB
Description High Performance Impact-X é PAL Circuit HIGH-PERFormANCE IMPACT-X E PAL CIRCUITS
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Brand: TI
Packaging CDIP
Delivery time
Packaging method
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(5205) Minimum order quantity(1)
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Technical parameters/operating temperature (Max): 125 ℃

Technical parameters/operating temperature (Min): -55 ℃

Encapsulation parameters/installation method: Through Hole

Package parameters/number of pins: 20

Encapsulation parameters/Encapsulation: CDIP

External dimensions/height: 3.56 mm

External dimensions/packaging: CDIP

Other/Product Lifecycle: Obsolete

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
5962-8515519RA 5962-8515519RA TI 完全替代 CDIP
高性能Impact -X é PAL电路 HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
TIBPAL16R6-10CN TIBPAL16R6-10CN TI 功能相似 DIP-20
TEXAS INSTRUMENTS TIBPAL16R6-10CN 可编程逻辑芯片, PAL, Impact-X, 10NS, 20-DIP

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