Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: PLCC-32
External dimensions/packaging: PLCC-32
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7208L25J
|
Integrated Device Technology | 功能相似 | PLCC-32 |
FIFO Mem Async Dual Depth/Width Uni-Dir 64K x 9 32Pin PLCC
|
||
7208L25JGI
|
Integrated Device Technology | 功能相似 | LCC-32 |
先进先出 3.3V 32K X 9 CMOS FIF
|
||
7208L25JI
|
Integrated Device Technology | 功能相似 | PLCC-32 |
先进先出 64K X 9 CMOS PARALLEL FIF
|
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