Technical parameters/dissipated power: 1068 mW
Technical parameters/input current (Min): 10 μA
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/dissipated power (Max): 1068 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DFP
External dimensions/packaging: DFP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 9A515.e.1
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-9163901MFA
|
TI | 完全替代 | CPAK |
RS-422接口集成电路 Not available Through Mouser
|
||
DS26C31MW/883
|
TI | 完全替代 | DFP |
CMOS 四路三态差动线路驱动器 16-CFP -55 to 125
|
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