Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Ammo Pack
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCF4016BEY
|
ST Microelectronics | 功能相似 | DIP-14 |
四路双向开关 QUAD BILATERAL SWITCH
|
||
HEF4066BPN
|
NXP | 功能相似 | DIP |
IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14, PLASTIC, DIP-14, Multiplexer or Switch
|
||
TC4016BP
|
Toshiba | 功能相似 | DIP |
Analog Switch Quad SPST
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review