Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT72V273L6BC
|
Panasonic | 功能相似 |
3.3伏高密度SUPERSYNC窄总线FIFO 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO
|
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