Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA-324
External dimensions/packaging: LBGA-324
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 功能相似 | FBGA-324 |
CPLD MAX V Family 1700 Macro Cells 247.5MHz 1.8V 324Pin TFBGA
|
||
5M2210ZF324C4N
|
Altera | 功能相似 | FBGA-324 |
CPLD MAX V Family 1700 Macro Cells 247.5MHz 1.8V 324Pin TFBGA
|
||
5M2210ZF324C5N
|
Altera | 功能相似 | FBGA-324 |
CPLD MAX V Family 1700 Macro Cells 201.1MHz 1.8V 324Pin TFBGA
|
||
5M2210ZF324I5N
|
Intel | 功能相似 | FBGA-324 |
CPLD - 复杂可编程逻辑器件 CPLD - MAX V 1700 Macro 271 IOs
|
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