Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX6023EBT21+T
|
Maxim Integrated | 功能相似 | UCSP-5 |
V-Ref Precision 2.048V 0.5mA 5Pin UCSP T/R
|
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