Technical parameters/frequency: 25 MHz
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: CDIP
External dimensions/packaging: CDIP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A001A2C
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
AMD | 完全替代 | DIP |
标准高速PAL电路 STANDARD HIGH-SPEED PAL CIRCUITS
|
||
PAL16R4AMJ
|
TI | 完全替代 | CDIP |
标准高速PAL电路 STANDARD HIGH-SPEED PAL CIRCUITS
|
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