Technical parameters/power supply voltage (DC): 1.80 V
Technical parameters/kernel architecture: PowerPC
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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E2V | 功能相似 | BGA |
RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
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