Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOT-457
External dimensions/packaging: SOT-457
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BSL302SNL6327HTSA1
|
Infineon | 功能相似 | TSOP-6-6 |
TSOP N-CH 30V 7.1A
|
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