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Description Conn Unshrouded Header HDR 30POS 2.54mm Solder ST Thru-Hole Bag
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Brand: Molex
Packaging
Delivery time
Packaging method Bag
Standard packaging quantity 1
13.95  yuan 13.95yuan
5+:
$ 16.3250
50+:
$ 15.6274
200+:
$ 15.2367
500+:
$ 15.1390
1000+:
$ 15.0413
2500+:
$ 14.9297
5000+:
$ 14.8599
7500+:
$ 14.7902
Quantity
5+
50+
200+
500+
1000+
Price
$16.3250
$15.6274
$15.2367
$15.1390
$15.0413
Price $ 16.3250 $ 15.6274 $ 15.2367 $ 15.1390 $ 15.0413
Start batch production 5+ 50+ 200+ 500+ 1000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(2581) Minimum order quantity(5)
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Technical parameters/Contact electroplating: Tin, Gold

Technical parameters/rated current: 3 A

Technical parameters/number of rows: 2

Technical parameters/hot wire testing standards: Non-Compliant

Technical parameters/halogen-free state: Not Reviewed

Technical parameters/direction: Vertical

Technical parameters/number of circuits: 30

Technical parameters/Flammability level: UL 94 V-0

Technical parameters/number of pins: 30

Technical parameters/rated voltage: 250 VDC

Physical parameters/contact material: Copper Alloy

Physical parameters/materials: Copper Alloy

Other/Product Lifecycle: Active

Other/Packaging Methods: Bag

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/ELV standards: Compliant

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
10-89-7301 10-89-7301 Molex 功能相似
2.54毫米( .100“ )间距C- Grid®分离针座,双排,垂直,高温, 30电路,锡(Sn )镀层, 2.72毫米( 0.107 ” ) PCB焊脚长度 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length
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