Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
F507
|
Yageo | 功能相似 |
Memory Circuit, Flash+PSRAM, 32MX16, CMOS, PBGA105, 9 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, SCSP-105
|
|||
PF38F5070M0Y0B0
|
Numonyx | 功能相似 | TFBGA |
2048MBIT SIBLEY WIRELESS FLASH MEMORY
|
||
PF38F5070M0Y0B0
|
Intel | 功能相似 | TFBGA |
2048MBIT SIBLEY WIRELESS FLASH MEMORY
|
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