Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: SOT-23
External dimensions/packaging: SOT-23
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Agilent | 功能相似 | SOT-23 |
50V, SILICON, PIN DIODE, ROHS COMPLIANT, SOT-23, 3Pin
|
||
HSMP-3824-BLKG
|
Broadcom | 功能相似 | SOT-23-3 |
50V, SILICON, PIN DIODE, ROHS COMPLIANT, SOT-23, 3Pin
|
||
HSMP-3824-BLKG
|
AVAGO Technologies | 功能相似 | SOT-23-3 |
50V, SILICON, PIN DIODE, ROHS COMPLIANT, SOT-23, 3Pin
|
||
HSMP-3824-TR1G
|
Broadcom | 功能相似 | SOT-23-3 |
50V, SILICON, PIN DIODE, ROHS COMPLIANT, SOT-23, 3Pin
|
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