Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC4075D
|
NXP | 功能相似 | SOIC |
逻辑门 74HC4075D SO-14
|
||
|
|
ST Microelectronics | 功能相似 | SOP |
三路3输入或门 TRIPLE 3 INPUT OR GATE
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review