Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
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Integrated Device Technology | 功能相似 | DIP |
CMOS异步FIFO与重传1K ×9 , 2K ×9 , 4K ×9 CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9
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