Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7285L15PAGI
|
Integrated Device Technology | 功能相似 | TFSOP-56 |
FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 x 2 56Pin TSSOP Tube/Tray
|
||
72V85L15PAG
|
Integrated Device Technology | 功能相似 | TSSOP-56 |
3.3伏的CMOS双异步FIFO DUAL 512× 9 ,双1024× 9双2048 ×9 ,双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
|
||
72V85L15PAG
|
Renesas Electronics | 功能相似 | TFSOP-56 |
3.3伏的CMOS双异步FIFO DUAL 512× 9 ,双1024× 9双2048 ×9 ,双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
|
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