Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM13700N/NOPB
|
TI | 功能相似 | DIP-16 |
TEXAS INSTRUMENTS LM13700N/NOPB 跨导放大器, 双路, 2个放大器, 18 V, 2 MHz, -5 V, 5 V, DIP
|
||
LM13700N/NOPB
|
National Semiconductor | 功能相似 | DIP-16 |
TEXAS INSTRUMENTS LM13700N/NOPB 跨导放大器, 双路, 2个放大器, 18 V, 2 MHz, -5 V, 5 V, DIP
|
||
NE5517N
|
NXP | 功能相似 | DIP |
双路运算跨导放大器 Dual operational transconductance amplifier
|
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