Technical parameters/digits: 8
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DAC0802LCN/NOPB
|
TI | 类似代替 | DIP-16 |
PARALLEL, 8Bits INPUT LOADING, 0.1us SETTLING TIME, 8Bit DAC, PDIP16, LEAD FREE, PLASTIC, DIP-16
|
||
DAC0802LCN/NOPB
|
National Semiconductor | 类似代替 | DIP-16 |
PARALLEL, 8Bits INPUT LOADING, 0.1us SETTLING TIME, 8Bit DAC, PDIP16, LEAD FREE, PLASTIC, DIP-16
|
||
|
|
Raytheon | 类似代替 | DIP |
DAC 1CH Segment 8Bit 16Pin CDIP
|
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