Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7205L30DB
|
Integrated Device Technology | 功能相似 | CDIP-28 |
FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 28Pin CDIP
|
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|
Integrated Device Technology | 功能相似 | CDIP-28 |
Ic Mem Fifo 8K x 9 Async 28cdip
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|
Integrated Device Technology | 功能相似 | DIP |
CMOS异步FIFO 2048× 9 , 4096 ×9 , 8192 ×9和16384 ×9 CMOS ASYNCHRONOUS FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9
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