Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV3492AMDREP
|
TI | 功能相似 | SOIC-8 |
1.8V,纳安级功耗, PUSH / PULL输出比较 1.8 V, NANOPOWER, PUSH/PULL OUTPUT COMPARATORS
|
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