Package parameters/number of pins: 84
Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Physical parameters/operating temperature: 0℃ ~ 85℃
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Micron | 功能相似 | FBGA |
DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84Pin FBGA Tray
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