Technical parameters/Contact electroplating: Gold, Gold over Nickel
Technical parameters/insulation resistance: 5000 MΩ
Encapsulation parameters/installation method: Panel
External dimensions/height: 17.5 mm
Physical parameters/contact material: Brass
Physical parameters/insulation material: Teflon
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
13-21-2 TSS 50R
|
Multicomp | 功能相似 |
MULTICOMP 13-21-2 TSS 50R 射频/同轴连接器, BNC同轴, 直型插头, 50 ohm, 黄铜
|
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