Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP
External dimensions/packaging: TSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TE28F800B3B90
|
Intel | 功能相似 |
SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32Mbit FLASH MEMORY FAMILY
|
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