Technical parameters/conversion rate: 20.0 V/μs
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 12
Encapsulation parameters/Encapsulation: SIP-12
External dimensions/packaging: SIP-12
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
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