Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: VFBGA
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29WS256P0PBFW000
|
Cypress Semiconductor | 完全替代 | FBGA-84 |
闪存, MirrorBit架构, 并行NOR, 512 Mbit, 32M x 16位, CFI, 并行, FBGA, 84 引脚
|
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