Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SSOP-28
External dimensions/packaging: SSOP-28
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
9DB403DGILFT
|
Integrated Device Technology | 功能相似 | TSSOP-28 |
四个输出差分缓冲器为PCIe第一代和第二代 Four Output Differential Buffer for PCIe Gen 1 and Gen 2
|
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