Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UCC2941D-5
|
TI | 功能相似 | SOIC |
1V Synchronous Boost Converter 8-SOIC -40℃ to 85℃
|
||
UCC39412D
|
TI | 功能相似 | SOIC-8 |
IC REG BST 3.3V 60mA SYNC 8SOIC
|
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